The provided Heat Sink product is suitable to be used with high-power semiconductor devices owing to its high effectiveness and dimensional uniformity. People use this product with electronic devices for dissipating heat produced in CPUs, transistors, optoelectronics and graphics processors. The offered product is capable of transferring thermal energy from high temperature or heated devices to low-temperature fluids. This product transfers high temperature by incorporating convection, radiation and conduction methods. Clients can avail the offered Heat Sink product from us in various shapes, sizes, designs and other standard configurations. It is made up of quality assured raw materials and advanced extrusion techniques.